英语语法分析

The first underfill is filled between the first chip and the second chip in order to wrap the first bump.

以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.

用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。